Through-Silicon Vias for 3D Integration - John Lau - Books - McGraw-Hill Education - Europe - 9780071785143 - December 16, 2012
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Through-Silicon Vias for 3D Integration Ed edition

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This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits—essential for the development of low-cost, high-performance electronic and optoelectronic products.


512 pages, ill

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 16, 2012
ISBN13 9780071785143
Publishers McGraw-Hill Education - Europe
Pages 512
Dimensions 160 × 231 × 21 mm   ·   722 g

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