Shipments to the United States
Due to changes in U.S. customs regulations, all shipments to the United States are now subject to customs clearance.
This means that the recipient will be required to pay customs duties, as well as any applicable taxes and fees upon import.
Please also note that delivery may be delayed while the shipment is being processed by U.S. customs.
![Cover for John Lau · 3D IC Integration and Packaging (Hardcover Book) [Ed edition] (2015)](https://imusic.b-cdn.net/images/item/original/060/9780071848060.jpg?john-lau-2015-3d-ic-integration-and-packaging-hardcover-book&class=scaled&v=1647908841)
![Cover for John Lau · Through-Silicon Vias for 3D Integration (Hardcover Book) [Ed edition] (2012)](https://imusic.b-cdn.net/images/item/original/143/9780071785143.jpg?john-lau-2012-through-silicon-vias-for-3d-integration-hardcover-book&class=scaled&v=1647908435)
![Cover for John Lau · Thermal Stress and Strain in Microelectronics Packaging (Paperback Book) [Softcover reprint of the original 1st ed. 1993 edition] (2012)](https://imusic.b-cdn.net/images/item/original/696/9781468477696.jpg?john-lau-2012-thermal-stress-and-strain-in-microelectronics-packaging-paperback-book&class=scaled&v=1539207051)
![Cover for John Lau · Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Hardcover Book) [Ed edition] (2010)](https://imusic.b-cdn.net/images/item/original/791/9780071753791.jpg?john-lau-2010-reliability-of-rohs-compliant-2d-and-3d-ic-interconnects-hardcover-book&class=scaled&v=1647908286)