Shipments to the United States
Due to changes in U.S. customs regulations, all shipments to the United States are now subject to customs clearance.
This means that the recipient will be required to pay customs duties, as well as any applicable taxes and fees upon import.
Please also note that delivery may be delayed while the shipment is being processed by U.S. customs.
![Cover for John H. Lau · Chiplet Design and Heterogeneous Integration Packaging (Paperback Book) [2023 edition] (2024)](https://imusic.b-cdn.net/images/item/original/192/9789811999192.jpg?john-h-lau-2024-chiplet-design-and-heterogeneous-integration-packaging-paperback-book&class=scaled&v=1722057566)
![Cover for John H. Lau · Chiplet Design and Heterogeneous Integration Packaging (Hardcover Book) [2023 edition] (2023)](https://imusic.b-cdn.net/images/item/original/161/9789811999161.jpg?john-h-lau-2023-chiplet-design-and-heterogeneous-integration-packaging-hardcover-book&class=scaled&v=1695532633)
![Cover for John H. Lau · Semiconductor Advanced Packaging (Paperback Book) [2021 edition] (2022)](https://imusic.b-cdn.net/images/item/original/784/9789811613784.jpg?john-h-lau-2022-semiconductor-advanced-packaging-paperback-book&class=scaled&v=1653589884)
![Cover for John H. Lau · Assembly and Reliability of Lead-Free Solder Joints (Paperback Book) [2020 edition] (2021)](https://imusic.b-cdn.net/images/item/original/220/9789811539220.jpg?john-h-lau-2021-assembly-and-reliability-of-lead-free-solder-joints-paperback-book&class=scaled&v=1622167029)
![Cover for John H. Lau · Semiconductor Advanced Packaging (Hardcover Book) [2021 edition] (2021)](https://imusic.b-cdn.net/images/item/original/753/9789811613753.jpg?john-h-lau-2021-semiconductor-advanced-packaging-hardcover-book&class=scaled&v=1623687781)
![Cover for John H. Lau · Assembly and Reliability of Lead-Free Solder Joints (Hardcover Book) [2020 edition] (2020)](https://imusic.b-cdn.net/images/item/original/190/9789811539190.jpg?john-h-lau-2020-assembly-and-reliability-of-lead-free-solder-joints-hardcover-book&class=scaled&v=1588376991)
![Cover for John H. Lau · Heterogeneous Integrations (Hardcover Book) [2019 edition] (2019)](https://imusic.b-cdn.net/images/item/original/230/9789811372230.jpg?john-h-lau-2019-heterogeneous-integrations-hardcover-book&class=scaled&v=1588376885)
![Cover for John H. Lau · Fan-Out Wafer-Level Packaging (Paperback Book) [Softcover Reprint of the Original 1st 2018 edition] (2018)](https://imusic.b-cdn.net/images/item/original/660/9789811342660.jpg?john-h-lau-2018-fan-out-wafer-level-packaging-paperback-book&class=scaled&v=1588376983)
![Cover for John H. Lau · Fan-Out Wafer-Level Packaging (Hardcover Book) [2018 edition] (2018)](https://imusic.b-cdn.net/images/item/original/834/9789811088834.jpg?john-h-lau-2018-fan-out-wafer-level-packaging-hardcover-book&class=scaled&v=1588376972)
![Cover for John H. Lau · Solder Joint Reliability: Theory and Applications (Paperback Book) [Softcover reprint of the original 1st ed. 1991 edition] (2014)](https://imusic.b-cdn.net/images/item/original/437/9781461367437.jpg?john-h-lau-2014-solder-joint-reliability-theory-and-applications-paperback-book&class=scaled&v=1516985150)
![Cover for John H. Lau · Handbook Of Tape Automated Bonding (Hardcover Book) [1992 edition] (1992)](https://imusic.b-cdn.net/images/item/original/279/9780442004279.jpg?john-h-lau-1992-handbook-of-tape-automated-bonding-hardcover-book&class=scaled&v=1570666783)
![Cover for John H. Lau · Solder Joint Reliability: Theory and Applications (Hardcover Book) [1991 edition] (1991)](https://imusic.b-cdn.net/images/item/original/602/9780442002602.jpg?john-h-lau-1991-solder-joint-reliability-theory-and-applications-hardcover-book&class=scaled&v=1516985150)